UV oven ni gaw, ultraviolet (UV) n-gun hpe shayawm ai hpaji hte, n-gun- hpe hkang lu ai n-gun shayawm ai ladat ni hpe kayau kaya lang ai, rawt jat galu kaba wa ai jak ni rai nga ai. Laika dip ai, electronic, coating, tsi mawan ni hte kaga lam ni hta law law lang lang ai, shanhte a bungli galaw ai atsam grai law ai, grup yin hpe n hkra ai, hkrak hkrak galaw lu ai majaw, dai ni na aten na hpaga lam hta ahkyak ai arung arai langai byin wa sai.
UV oven a madung bungli gaw, nhtoi hpe hkam sha chye ai arung arai ni (UV adhesives, coatings, inks zawn re ai ni hpe) ultraviolet nhtoi hte lawan ladan shamai shatsai ya lu ai. Htunghking hku nbung katsi ai hku hkyet ai (sh) nbung hte hkyet ai ladat hte shingdaw yu yang, UV hkyet ai lam gaw second kaw nna second shi daram sha aten la ra ai majaw, galaw shapraw ai aten hpe grai kadun shangun nna, n-gun lang ai lam hpe mung shayawm ya lu ai. UV wan wut ni gaw, n-gun kaba ai-UV wan kaw na, masat da ai wavelength (madung hku nna 365nm shing nrai 405nm) a ultraviolet nhtoi hpe shapraw nna bungli galaw ai rai nna, dai gaw, dai arai kata na photoinitiator ni hpe shadut ya nna, chemical reaction hpe shabyin ya ai. UV oven nkau mi hta mung infrared (sh) nbung katsi ai hpe katsi shangun ai module ni hpe mung hpawng de da nna, nbung katsi ai hpe hkang ai ladat ni hpe lang nna, kata na katsi ai hpe gram lajang ai hku nna, arai amyu myu a hkamja lam hpe hkan sa lu hkra galaw ai.
Ndai jak gaw ahkyak ai akyu ni hpe jaw ya ai: Langai, grai akyu rawng ai hte n-gun-htuk manu ai, htunghking UV tsi lajang ai ladat ni lang ai n-gun atsam hta na 10%-20% sha jai lang ai. Lahkawng, grup yin hpe shim lum ai hte shim lum ai, solvent volatilization n lawm ai majaw VOC dat dat ai lam hpe shayawm ya lu ai. Masum, shi gaw hkang lu ai hkrak ai lam hpe jaw ya ai, UV n-gun, n-gun dat ai aten, nbung katsi ai lam ni hpe hkrak hkrak galai shai ai hku nna, langai sha re ai hte ngang grin ai tsi lajang ai lam hpe lu la hkra galaw ya ai. Laksan jai lang ai lam ni hta, UV oven ni hpe mobile phone screen ni a matu adhesive ni hpe lawan ladan gram lajang na matu, PCB ni hta solder mask hpe katsi hkra galaw na matu, mawdaw a daw ni hpe n-gun n rawng ai coating ni hpe bang na matu, tsi mawan lang ai arung arai ni hpe pyi n-gun n rawng hkra galaw na matu hte shinggyin la na matu jai lang mai ai.
Dai ni na aten na UV wan wut ni hta mung, touch panel, real-time nbung katsi ai hpe yu reng ai, mara hpe tinang nan - jep chyoi ai ladat ni zawn re ai hpaji rawng ai atsam ni hpe mung bang da ai majaw, bungli galaw ai lam hta grau nna shim lum ai hte kam hpa mai ai lam ni hpe jat ya lu ai. Material science hte light-curing hpaji masa ni hta rawt jat wa ai hte maren, UV oven ni gaw grau nna akyu rawng ai, multi-band htuk manu ai, hte automated integration de rawt jat wa nga ai, dai gaw hkrak tup galaw shapraw ai lam hte hkai sun galaw shapraw ai lam hpe woi awn ai ahkyak ai arung arai langai byin tai wa sai.
