Material hpaji hte engineering hta ahkyak ai hpaji masa langai hku nna, n-gun ja ai ladat ni hpe coating, electronic packaging, n-gun ja ai arung arai ni hte kaga lam ni hta grai lang ma ai. Curing system amyu myu gaw shanhte a ladat, bungli galaw ai lam, jai lang mai ai masa ni hta grai shai hkat nga ai. Dai ni hpe madung hku nna thermal curing, nhtoi hte n-gun, hka hte n-gun, chemical curing ngu nna garan ginhka mai ai.
Thermal curing gaw htunghking hku nna n-gun ja dik ai ladat rai nna, n-gun ja ai hku nna resin kata kaw cross-linking reaction hpe galaw hpang nna, ngang grin ai n-gun masum rawng ai network hkrang hpe shabyin ya ai. Shi a akyu gaw, atsawm sha tsi lajang lu ai hte, arung arai amyu myu hte htuk manu ai lam ni hta rai nga ai, raitim, n-gun law law jai lang ra ai majaw, tsi lajang na matu aten grai na hkra la ra ai. Dai hpe magri shingnip, nhprang arai shingnip zawn re ai shara ni hta lang ai. Dai hte nhtan shai ai hku nna, nhtoi hte tsi lajang ai shaloi, ultraviolet (UV) (sh) mu lu ai nhtoi hpe lang nna, nhtoi hpe hkam sha lu ai atsam hpe shabyin ya ai majaw, lawan ai hku tsi lajang lu ai. Ndai n-gun-hkye la ai hte -htuk manu ai lam grai law ai ladat gaw, hkrak tup ai electronic arung arai ni hte 3D dip shapraw ai arung arai ni a matu grau nna htuk manu ai. Raitim, nhtoi hte n-gun dat ai shaloi, n-gun ja ai arung arai ni hpe n-gun dat ra ai rai nna, deep-layer n-gun dat ai atsam gaw shadawn sharam sha nga ai.
Moisture curing gaw, polyurethane arung arai ni zawn re ai, grup yin kata na hka hpe kam hpa nna, n-gun rawng ai lam hpe shabyin ya ai rai nna, hka lim ai shara ni hta shinggrup da nna, shinggrup da na matu htuk manu ai. Shi a akyu gaw, n-gun jat ra ai lam n nga ai raitim, shi a tsi lajang ai lawan ai lam hpe hka lim ai majaw grai hkra machyi shangun ai. Chemical curing gaw, n-gun dat (sh) n-gun dat dat ai baw hpe bang nna, n-gun dat hpe hpang wa ai. Ga shadawn, epoxy resin system ni hta, n-gun rawng ai n-gun hpe gram lajang ai hku nna, n-gun rawng ai n-gun hpe hkang lu ai. Ndai lam gaw, -hpaji rawng ai composite arung arai ni a matu htuk manu shangun ai.
Curing system amyu myu hpe lata ai shaloi, arung arai ni a arawn alai, galaw sa wa ra ai lam ni, manu jahpu-htuk manu ai lam ni hpe atsawm sha myit yu ra ai. Ga shadawn, electronics hpaga lam gaw kaji kajaw galaw shapraw na matu nhtoi-curing hpe ra sharawng ai, nta gawgap hpaga lam gaw yak hkak ai makau grup yin ni hpe hkap la lu na matu moisture (sh) chemical curing hpe grau kam hpa ai. Htawm hpang de grup yin hpe makawp maga ai lam hte n-gun atsam rawng ai lam ni law wa ai hte maren, n-gun rawng ai n-gun rawng ai hpaji masa ni hte hkai sun galaw ai ladat ni hpe sawk sagawn nna gyin shalat ai lam gaw ahkyak ai lam ni tai wa na re.
